China Manufacturer Low Melting Point Tin Lead Solder Wire Sn50/Pb50

• Application: Electronics, Industrial, Aviation, Electronics, Industrial, Medical, Chemical
• Standard: DIN, BS, JIS, GB, DIN, BS, ASTM, AISI
• Purity: >99.5%, >98%
• Type: Zinc Strip, Tin Ingot
• Alloy: Non-alloy, Non-Alloy
• Powder: Not Powder
• Model NO.: Sn50/Pb50
• Shape: Lump
• Transport Package: as Your Required
• Specification: as your required
• Trademark: Shenyang steel
• Origin: China
• Production Capacity: 3000 Ton/Tons Per Month

Product Description

Low Melting Point Solder Wire

Product Information

Product Name	Lead free solder wire
Composition	Sn--3.8Ag-0.7Cu
Melting Point	47ºC/58ºC/60ºC/70ºC/75ºC/82ºC/92ºC/100ºC/103ºC/110ºC/120ºC/125ºC/138ºC/145ºC/ 150ºC/160ºC/170ºC/183ºC/190ºC/200ºC/210ºC/220ºC/230ºC/250ºC/280ºC,etc
Working Temperature	230-260ºC
Diameter	0.5-5.0mm
Weigh	100g/200g/250g/500g/800g/1000g
Flux Content	1.8-2.2%
Applications	Main used for the soldering of precision instruments, electrical  and electronics, wave soldering and circuit board elements  and aviation

 

Performance

• Nontoxic and environment friendly
• Low melting point and stability
• tidiness surface and not easy to tie
• non-flux pollution
• no dross residual.
•