Application: | Aviation, Electronics, Aviation, Electronics, Industrial, Medical, Chemical |
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Standard: | JIS, GB, JIS, GB, DIN, BS, ASTM, AISI |
Purity: | >99.5%, >98% |
Type: | Tin Ingot, Tin Ingot |
Shape: | Lump, Square |
Alloy: | Non-alloy, Non-Alloy |
Customization: |
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Tin is a silver-white and soft metal and it looks brighter.
Its hardness is relatively low, it also has good ductility.It can be used as a coating material, it has a very widerange of uses in the machinery, electrical appliances,automotive, aerospace and other industrial sectors.In the production of float glass, the molten glass floats onthe surface of the molten tin pool and solidifies.
SPECIFICATION
Item |
Sn 99.90 |
Sn 99.95 |
Sn 99.99 |
Sn %≥ |
99.90 |
99.95 |
99.99 |
As %≤ |
0.008 |
0.003 |
0.0005 |
Fe %≤ |
0.007 |
0.004 |
0.002 |
Cu %≤ |
0.008 |
0.004 |
0.0005 |
Pb %≤ |
0.032 |
0.020 |
0.0035 |
Bi %≤ |
0.015 |
0.006 |
0.0025 |
Sb %≤ |
0.020 |
0.014 |
0.0015 |
Cd %≤ |
0.0008 |
0.0005 |
0.0003 |
Zn %≤ |
0.001 |
0.0008 |
0.0003 |
Al %≤ |
0.001 |
0.0008 |
0.0005 |
S %≤ |
0.0005 |
0.0005 |
0.0003 |
Ag %≤ |
0.005 |
0.0001 |
0.0001 |
Ni+Co %≤ |
0.005 |
0.005 |
0.0006 |
Application:
Metal tin is mainly used in the manufacture of alloys. Tin and sulfur compounds - tin sulfide, which is similar in color to gold, is commonly used as a gold pigment. Tin's modern application is as a solder for the electronics industry. Used in various purities and alloys (often with lead or indium), tin solders have a low melting point, which makes them suitable for bonding materials.
Packaging & Shipping
Our Packaging aims to offer packing solutions to our clients to enable safety and premium handling services to ensure client goods arrive to they ports with no damages.
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